C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/3035
C08L 51/06 (2006.01) C08L 23/10 (2006.01) C08L 23/16 (2006.01) C08L 63/00 (2006.01) C08L 67/00 (2006.01) C08L 67/02 (2006.01)
Patent
CA 1329435
ABSTRACT OF THE DISCLOSURE The modified polypropylene resin composition of the present invention comprises a blend of a resin composition composed of polypropylene type resin (C) selected from the group consisting of a modified polypropylene (A) obtained by graft copoly- merizing an unsaturated carboxylic acid or a derivative thereof and an unsaturated aromatic monomer onto a polypropylene, and modified polypropylene (A)/polypro- pylene (B) composition, and a saturated polyester resin (D), an epoxy group containing copolymer (E), and a basic compound (F) optionally added as a reaction accelerator. The modified polypropylene resin composition according to the present invention is not only good in molding processability but also markedly effective in that it can give molded products much superior in physical properties to those obtained from individual polymers constituting the thermoplastic resin composition. The novel modified polypropylene resin composition provided by the present invention can easily be processed into a molded product, a film, a sheet or the like by a molding method usually used for molding thermoplastic resins, for example, injection molding, extrusion molding or the like, giving a product which has a very good balance among stiffness, heat resistance, impact resistance, scratch resistance, coating properties, oil resistance, chemical resistance, water resistance, etc., and is excellent in appearance uniformity and smoothness. It can be advantageously used for a purpose requiring especially high heat resistance and impact resistance, in particular, low- temperature impact resistance.
595232
Fujii Takeshi
Mitsuno Tatsuyuki
Okada Mitsuyuki
Okada Takayuki
Yamaguchi Kentaro
Marks & Clerk
Sumitomo Chemical Co. Ltd.
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