C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 291/00 (2006.01) C08F 2/00 (2006.01) C08F 8/34 (2006.01) C08F 220/38 (2006.01)
Patent
CA 2171914
A composition suitable as a modifier for polymer, is disclosed, for example, which composition comprises: (1) a compound illustrated bellow by the general formula: (1) Image (1) wherein, R is hydrogen atom or methyl group, A is an alkylene group having 2-4 carbon atoms, (OA) n indicates a polyoxyalkylene group, M is a monovalent or divalent cation, n is 2-30, and m is 1 or 2 ; (2) 50-3,000 ppm, based on the weight of the composition, of hydroquinone monomethyl ether as an organic polymerization inhibitor ; and (3) 0.01-20 ppm of copper ion based on the weight of the composition. The modifier composition of the present invention has an excellent thermal shelf stability at an ordinary temperature.
Gyotoku Nami
Hisada Nobuo
Inden Yoshimi
Yamauchi Tadashi
Robic
Sanyo Chemical Industries Ltd.
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