Modifier composition and a modified polymer

C - Chemistry – Metallurgy – 08 – F

Patent

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Details

C08F 291/00 (2006.01) C08F 2/00 (2006.01) C08F 8/34 (2006.01) C08F 220/38 (2006.01)

Patent

CA 2171914

A composition suitable as a modifier for polymer, is disclosed, for example, which composition comprises: (1) a compound illustrated bellow by the general formula: (1) Image (1) wherein, R is hydrogen atom or methyl group, A is an alkylene group having 2-4 carbon atoms, (OA) n indicates a polyoxyalkylene group, M is a monovalent or divalent cation, n is 2-30, and m is 1 or 2 ; (2) 50-3,000 ppm, based on the weight of the composition, of hydroquinone monomethyl ether as an organic polymerization inhibitor ; and (3) 0.01-20 ppm of copper ion based on the weight of the composition. The modifier composition of the present invention has an excellent thermal shelf stability at an ordinary temperature.

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