Modular circuit packaging arrangement and method

Details Modular circuit packaging arrangement and method Modular circuit packaging arrangement and method

G - Physics

04

C

347/35

G04C 3/00 (2006.01) H05K 5/06 (2006.01)

Patent

CA 1067195

A MODULAR CIRCUIT PACKAGING ARRANGEMENT AND METHOD Abstract of the Disclosure The present invention relates to a modular circuit package arrangement and method. The package is comprised of a circuit device which has a plurality of terminal pads, an external circuit component, and a metal lead frame which has a plurality of lead conductors. At least one of the conductors ohmically couples the external circuit component to the circuit device. A unit is provided which selectively ohmically connects the terminal pads to the lead conductors. An encapsulating unit is provided which completely encapsulates the circuit device. The encapsulating unit has a cavity selectively positioned therein with respect to the at least one conductor, so that a portion of the at least one conductor is exposed through an opening in the cavity. The external circuit component is located within the cavity. An opening is provided in the encapsulating unit opposite the cavity. This opening exposes a portion of the at least one conductor to facilitate its ohmic connection with said external circuit component.

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