H - Electricity – 01 – R
Patent
H - Electricity
01
R
H01R 13/514 (2006.01) H01R 33/76 (2006.01) H05K 7/10 (2006.01)
Patent
CA 2339498
A modular construction of connectors is provided for reducing the effects of the differential coefficient of thermal expansion of the connectors and the underlying circuit board. Each connector of the modular construction is mounted on a known circuit board or the like and could receive therein an integrated circuit chip carrier or could mount to another board. The principle of solder surface tension and self centering characterized in ball grid array (BGA) surface mount technology is used to form an array connector having multiple components that form a larger array pattern or group of arrays.
Berg Technology Inc.
Bkp Gp
Fci America's Technology Inc.
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