B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/756
B29C 47/06 (2006.01) B29C 47/28 (2006.01) B29C 47/86 (2006.01)
Patent
CA 1281522
Abstract A modular extrusion head is disclosed including a plurality of cross head die modules, each including a flow path for a single resin. Molten resin layers are flowed from the modules onto a stepped mandrel and then along the mandrel and out an extrusion die to form a multi-layer parison. The layers are thin, with a uniform thickness and hole free. The modules are temperature zoned to permit flowing of a low temperature resin to and along the mandrel in contact with a high temperature resin without impairing the properties of the low temperature resin.
540733
Briggs Milton
Teutsch Erich O.
Company General Electric
Graham Engineering Corporation
Macrae & Co.
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