Modular relay

H - Electricity – 01 – H

Patent

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Details

H01H 50/14 (2006.01) H01H 50/02 (2006.01) H01H 50/04 (2006.01)

Patent

CA 2189458

The modular relay has a base (1) on which a relay system (2, 3, 4) is constructed, as well as a printed circuit board (6) which stands upright on the base. Contact elements (41c, 42c, 43) of the relay are directly connected to flat connectors in the base, via conductor elements. Further conductor elements in the base like- wise form flat connector as connections for a modular circuit which is arranged on the printed circuit board. All conductor elements of the base additionally form solder connecting pins (51b to 56b), which are integrally formed, all emerge in a row on one side wall of the base, and are soldered to the printed circuit board in the lower edge region of said printed circuit board. This results in a compact modular structure for a relay having a maximum number of connecting elements, the allocation of these connecting elements being variable for different modular circuits.

Le relais modulaire décrit comporte un socle (1) sur lequel est monté un système de relais (2, 3, 4), et une carte de circuits (6) disposée verticalement sur le socle. Des éléments de contact (41c, 42c, 43) du relais sont connectés directement, par l'intermédiaire de conducteurs, à des fiches plates dans le socle. Des conducteurs supplémentaires dans le socle forment également des connexions sous forme de fiches plates destinées à un circuit modulaire monté sur la carte de circuits. Tous les conducteurs du socle constituent d'autre part des broches de connexion soudées (51b à 56b), monobloc, qui font saillie en une rangée sur une paroi latérale du socle et sont soudées à la carte de circuits dans sa région marginale inférieure. On obtient ainsi une configuration modulaire compacte du relais avec un nombre maximal d'éléments de connexion, l'implantation de ces éléments de connexion étant variable pour différents circuits modulaires.

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