Module sealing structure

Details Module sealing structure Module sealing structure

H - Electricity

05

K

277/2, 356/21

H05K 1/00 (2006.01) H01L 23/10 (2006.01) H01L 23/20 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1298667

27879-3 ABSTRACT OF THE DISCLOSURE A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a plated printed circuit having a substrate and a plurality of integrated circuit elements provided on a first surface of the substrate. The integrated circuit elements are in contact with ends of the bellows structures. A metal fitting secured on the cold plate has a flange disposed beneath the other surface of the substrate to present a junction between the second surface of the substrate and the flange of the metal fitting. A polyimide layer is formed on the surface of the substrate and a conductor layer is formed on the polyimide layer. The polyimide layer and the conductor layer are approximately ring shaped at least at the peripheral portions of the substrate. The flange of the metal fitting is fixed to the substrate by solder provided between the conductor layer and the flange, to thereby provide a seal between the substrate and the flange.

600354

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