Moisture-crosslinking hot-melt adhesives which emit no or...

Details Moisture-crosslinking hot-melt adhesives which emit no or... Moisture-crosslinking hot-melt adhesives which emit no or...

C - Chemistry, Metallurgy

09

J

C09J 175/04 (2006.01) C08G 18/10 (2006.01) C08G 18/28 (2006.01) C08G 18/80 (2006.01) C08G 18/83 (2006.01) C08G 59/28 (2006.01)

Patent

CA 2193934

Disclosed is a moisture-crosslinking hot-melt adhesive which comprises: (1) a reaction product of: [A] a low molecular weight polyol having a molecular weight of from 500 to 10,000, [B] a diisocyanate, and [C] a hydroxyepoxide, and (2) an anhydride. The moisture-crosslinking hot-melt adhesive does not generate carbon dioxide during curing.

n décrit un adhésif thermofusible à réticulation médiée par l'humidité qui comprend : (1) un produit provenant de la réaction entre : [A] un polyol de faible poids moléculaire, variant entre 500 et 10 000, [B] un diisocyanate, et [C] un hydroxyépoxyde, et (2) un anhydride. L'adhésif thermofusible à réticulation médiée par l'humidité ne dégage pas de dioxyde de carbone durant le durcissage.

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