C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 65/48 (2006.01) C08G 63/695 (2006.01) C08L 71/08 (2006.01) C08L 101/10 (2006.01)
Patent
CA 2164160
A moisture curable composition is claimed comprising (a) a condensation product of a polyacid chloride with an alkylene or oxyalkylene polymer having substituent groups condensible therewith with an organosilicon compound having at least one silicon-bonded group -R(NHR1)mNH2 e.g. a material of the general formula Image wherein each R may be the same or different and represent a linking group, each R' represents a group R(NHR1)mNH2, a hydrolysable group R'', a group R''' or a group R'Si(OSiR12)s- O- where R''' is a hydrocarbon group, m is from 0 to 10 and ? is from 0 to 1500 and (b) a curative. Preferred materials are amino silanes in which R'' is an oximo, alkoxy, alkenyloxy or alkoxyalkoxy group, R(NHR1)mNH2 is aminopropyl and ? is 0. The aminosilane is preferably .gamma.- aminopropyltrimethoxysilane or .gamma.-aminopropyltriethoxysilane and the organic polymer is a polyoxyalkylene glycol.
de La Croi Habimana Jean
Leempoel Patrick
Dow Corning S.a.
Gowling Lafleur Henderson Llp
LandOfFree
Moisture curable compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Moisture curable compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Moisture curable compositions will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1756680