Moisture curable compositions and method of curing moisture...

C - Chemistry – Metallurgy – 08 – J

Patent

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C08J 3/00 (2006.01) C08G 18/10 (2006.01) C08G 18/12 (2006.01) C08G 18/42 (2006.01) C08G 75/02 (2006.01) C08G 75/14 (2006.01) C08K 13/02 (2006.01) C08L 83/04 (2006.01) C08L 101/00 (2006.01)

Patent

CA 2085663

- 48 - ABSTRACT OF THE DISCLOSURE A moisture curable composition comprised of a moisture curable base and a curing agent which does not contain molecular water but which produces water upon activation so as to cure the curable base. The composition exhibits improved stability and shelf life and can be formulated so that curing of the composition can be controlled substantially independently of ambient conditions.

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