C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 183/06 (2006.01) C09J 183/04 (2006.01)
Patent
CA 2125365
MOISTURE-CURABLE HOT MELT SILICONE PRESSURE-SENSITIVE ADHESIVES ABSTRACT A moisture-curable silicone hot melt pressure- sensitive adhesive composition is disclosed, said composition comprising (i) a solid hydroxyl-functional organopolysiloxane resin comprising R3SiO1/2 siloxane units and SiO4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, respectively, wherein R is selected from hydrocarbon and halogenated hydrocarbon radicals and said hydroxyl content is 1.2 to 6 percent by weight; (ii) an alkoxy- functional diorganopolysiloxane polymer having a viscosity at 25°C. of 20 to 100,000 mPa?s (centipoise), the weight ratio of said resin to aid polymer being in the range 40:60 to 80:20; (iii) a silane of the formula R'4-ySiXy, in which R' is selected from hydrocarbon radicals and substituted hydrocarbon radicals having 1-6 carbon atoms, X is a hydrolyzable group and y is 2 to 4, the amount of said silane being sufficient to provide stability to said composition; and (iv) sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.
Brady William Patrick
Cifuentes Martin Eric
Schmidt Randall Gene
Schoenherr William Joseph
Strong Michael Raymond
Dow Corning Corporation
Gowling Lafleur Henderson Llp
LandOfFree
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