C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 77/26 (2006.01) C08L 83/06 (2006.01) C08L 83/08 (2006.01) C09J 183/04 (2006.01) C09J 183/06 (2006.01) C09J 183/08 (2006.01) C09J 183/14 (2006.01)
Patent
CA 2170689
There is disclosed herein a silicone pressure- sensitive adhesive composition which cures upon exposure to ambient moisture. Also disclosed, as a separate embodiment, is a hot-melt silicone pressure-sensitive adhesive composition. These embodiments generally comprise, as a tackifier, an organopolysiloxane resin containing one or more curing radicals and, as a linear siloxane polymer, at least one diorganopolysiloxane polymer containing one or more silicon-bonded hydrolyzable radicals with organic functionality. The weight ratio of said resin to said polymer in our compositions is within the range of 5:95 to 90:10. To these compositions, there is optionally added, as needed, an organic solvent to facilitate application, a catalyst system to cure ingredients, a certain silane and/or fillers. The resultant products formed from our compositons have surprisingly improved strength properties and even exhibit adhesive strengths at elevated temperatures.
Cifuentes Martin Eric
Lutz Michael Andrew
Schmidt Randall Gene
Strong Michael Raymond
Vanwert Bernard
Dow Corning Corporation
Gowling Lafleur Henderson Llp
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