Moisture-curable melt-processible ethylene copolymer adhesives

C - Chemistry – Metallurgy – 08 – F

Patent

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Details

C08F 8/08 (2006.01) C08F 8/42 (2006.01) C09J 123/26 (2006.01) C09J 143/04 (2006.01)

Patent

CA 2123903

2123903 9310200 PCTABS00022 Moisture-curable melt-processible adhesives are obtained by reacting certain ethylene copolymers containing an n-alkyl acrylate and a carefully limited amount of a carboxylic acid with a stoichiometric amount of an epoxy-silane. A process of preparing the moisture-curable melt-processible adhesives in the absence of solvent is also available.

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