C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 18/12 (2006.01) C08G 18/30 (2006.01) C08G 18/32 (2006.01) C09J 175/04 (2006.01)
Patent
CA 2640325
The invention is directed to a moisture cure adhesive composition for bonding structural wood substrates. The composition includes a moisture curable isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyol component, an aromatic polyol component, and an aromatic isocyanate component. The composition exhibits an extremely high heat resistance at 180 ~C.
La présente invention concerne une composition adhésive durcissant à l'humidité destinée à coller des substrats en bois de structure. La composition comprend un prépolymère de polyuréthane terminé par un isocyanate durcissable à l'humidité qui est un produit de la réaction d'un composant polyol aliphatique, d'un composant polyol aromatique et d'un composant isocyanate aromatique. La composition présente une résistance thermique extrêmement élevée à 180 °C.
Burrows Benjamin E.
Giorgini Albert M.
Gowling Lafleur Henderson Llp
H.b. Fuller Company
H.b. Fuller Licensing & Financing Inc.
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