Moisture cure adhesive for bonding structural wood

C - Chemistry – Metallurgy – 08 – G

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C08G 18/12 (2006.01) C08G 18/30 (2006.01) C08G 18/32 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2640325

The invention is directed to a moisture cure adhesive composition for bonding structural wood substrates. The composition includes a moisture curable isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyol component, an aromatic polyol component, and an aromatic isocyanate component. The composition exhibits an extremely high heat resistance at 180 ~C.

La présente invention concerne une composition adhésive durcissant à l'humidité destinée à coller des substrats en bois de structure. La composition comprend un prépolymère de polyuréthane terminé par un isocyanate durcissable à l'humidité qui est un produit de la réaction d'un composant polyol aliphatique, d'un composant polyol aromatique et d'un composant isocyanate aromatique. La composition présente une résistance thermique extrêmement élevée à 180 °C.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Moisture cure adhesive for bonding structural wood does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Moisture cure adhesive for bonding structural wood, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Moisture cure adhesive for bonding structural wood will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1702632

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.