C - Chemistry – Metallurgy – 07 – C
Patent
C - Chemistry, Metallurgy
07
C
C07C 251/08 (2006.01) C08F 299/02 (2006.01) C08F 299/06 (2006.01) C08G 59/40 (2006.01) C08G 59/68 (2006.01) C08G 59/70 (2006.01) C09J 4/06 (2006.01) C09J 5/06 (2006.01) C09J 155/00 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2108979
2108979 9218575 PCTABS00017 An adhesive composition for adhering two substrates includes a mixture of acrylate and epoxy with a tri- or tetrafunctional ketimine as a curing agent. The adhesive composition provides a two-stage cure in which, in a first stage, the adhesive is moisture cured at ambient temperature to provide green strength. In a second stage, the adhesive is post-cured at elevated temperatures to provide a high strength bond. The ketimine is formed from the reaction of diisopropyl ketone and an amine.
Bush Richard Wayne
Carney Eugene Edward
Borden Ladner Gervais Llp
Henkel Teroson Gmbh
W.r. Grace & Co.,-Conn.
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