C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 69/42 (2006.01) C08G 69/48 (2006.01) C09J 177/00 (2006.01)
Patent
CA 2094394
2094394 9207020 PCTABS00012 Described are moisture-setting polyamides containing reactive alkoxysilane groups. These polyamides have a low melt viscosity and can therefore be used, without plasticizers, as jointing compounds, fusion adhesives and/or sealing compounds. The polyamides are characterized in that the alkoxysilane groups they contain have general formula (I), in which n = 0, 1 or 2; R1 to R4 are non-reactive organic groups and R3 can also be H, the alkoxysilane group being linked to the polyamide group (PA) by a carbon atom belonging to the polyamide group.
Heucher Reimar
Kinzelmann Hans-Georg
Wichelhaus Juergen
Henkel Kommanditgesellschaft Auf Aktien
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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