Moisture-curing prepolymers

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 75/04 (2006.01) C08G 18/10 (2006.01) C08G 18/28 (2006.01) C08G 18/48 (2006.01) C08G 18/76 (2006.01) C08G 18/79 (2006.01) C09D 175/04 (2006.01)

Patent

CA 2502406

Solvent-containing formulations including NCO-containing prepolymers based on TDI isocyanurate polyisocyanates and diphenylmethane diisocyanates where some prepolymers are prepared using a polyetherdiol containing ethylene oxide blocks and having an ethylene oxide content of from 2 to 18% by weight, based on all the alkylene oxide units. The formulation have an NCO content of 1% to 7% by weight, a solids content of 20% to 70% by weight, a monomeric TDI content of less than 0.2% by weight and a monomeric methylenediphenyl diisocyanate content of less than 2% by weight,. The solvent-containing formulations can be prepared in organic solvents by reacting at least one of A) a TDI component comprising TDI isocyanurate polyisocyanates and B) an MDI component comprising diphenylmethane diisocyanates with C) a polyetherdiol. The solvent-containing formulations can be used in moisture-curing coating compositions, adhesive bonds and/or seals with substrates.

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