Moisture resistant splice assembly

Details Moisture resistant splice assembly Moisture resistant splice assembly

H - Electricity

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B

337/47

H01B 7/28 (2006.01) H01B 3/30 (2006.01) H01B 7/285 (2006.01) H01B 7/288 (2006.01) H02G 15/00 (2006.01)

Patent

CA 1332447

Abstract A splice assembly which employs a material that is activated by moisture to form a three-dimensional cross-linked network that blocks the ingress of water to the splice. The assembly comprises a moisture activatable material (encapsulant), at least two conductors spliced together, and, optionally, a splice closure. Prior to exposure to moisture, the encapsulant is sufficiently fluid to flow around and into the interstices of the splice assembly and establish intimate contact with the splice. The encapsulant remains fluid until it is contacted by moisture at which time the encapsulant begins to crosslink. Useful encapsulants include polymers and prepolymers based on polyurethanes, polysulfides, organopolysiloxanes, and combinations thereof.

583098

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