Moisture resistant, wet winding epoxy resin system...

C - Chemistry – Metallurgy – 08 – L

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400/5048, 400/79

C08L 63/00 (2006.01) B29C 39/00 (2006.01) C08G 59/24 (2006.01) C08G 59/50 (2006.01) C08J 5/04 (2006.01)

Patent

CA 1281835

Abstract Curable thermosetting resin compositions comprising at least one cycloaliphatic epoxy resin having at least two 1,2-epoxy groups per molecule, and certain aromatic diamines having three aromatic rings in the molecule are disclosed. Resin compositions comprised of, for example, bis(2/3-epoxycyclopentyl)ether and 1,3-bis(4-amino- phenoxy)benzene exhibit a highly desirable balance of phy- sical and chemical properties which renders such compos- itions ideally suited for use in the fabrication of wet winding composites. The resin compositions prepared in accordance with the invention have unexpectedly low vis- cosity, high glass transition temperatures, high tensile properties and unexpectedly low water uptake. Accord- ingly, the resin compositions find particular application in the preparation of composites by wet winding proce- dures.

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