B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/708
B29C 45/26 (2006.01) B29C 45/40 (2006.01)
Patent
CA 1327110
ABSTRACT OF THE DISCLOSURE This invention relates to a mold assembly, a method of mounting and removing an insert or inserts thereof and a method of ejecting. The insert or inserts for molding a molded surface or surfaces of a molded piece or pieces are movable in a direction perpendicular to a parting line. By this movement, the insert or inserts are inserted into an insert coupling portion or portions or removed therefrom. A device for clamping and moving the insert is combined with a device for ejecting the molded piece out of the mold.
597874
Nakagawa Tatsuzi
Nishimoto Tatsuo
Aida Engineering Ltd.
Borden Ladner Gervais Llp
Hoya Corporation
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