B - Operations – Transporting – 21 – D
Patent
B - Operations, Transporting
21
D
B21D 31/00 (2006.01) B21D 26/02 (2006.01)
Patent
CA 2350731
A mold clamping apparatus comprises a frame including a holding portion for holding the mold resisting the generated mold opening force and an open portion allowing the mold to be inserted into/taken out from the holding portion in the direction of the longer side of the mold, mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame; and mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure intending to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof to be achieved.
Haeno Tsutomu
Hiramatsu Koichi
Hiroshige Itsuro
Honda Osamu
Ishibashi Hiroo
Gowling Lafleur Henderson Llp
Nippon Steel Corporation
Toyota Jidosha Kabushiki Kaisha
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