Mold die for manufacturing optical module and manufacturing...

G - Physics – 02 – B

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Details

G02B 6/42 (2006.01) B29C 33/00 (2006.01) B29C 45/14 (2006.01) B29C 70/72 (2006.01)

Patent

CA 2059480

ABSTRACT An optical module is manufactured by using a mold die including cavity portions (11), (21) for holding an optical connector (34), electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package; alignment portions (12), (22) in which rectangular channels (12b), (22b) for aligning the optical connector (34) are formed; and partition plates (23), (27) disposed vertically between the cavity portions (11), (21) and the alignment portions (12), (22) and adapted to prevent a resin from flowing out from the cavity portions (11), (21) during resin molding. - 25 -

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