Mold for encapsulating a component having a lead at an angle...

Details Mold for encapsulating a component having a lead at an angle... Mold for encapsulating a component having a lead at an angle...

B - Operations, Transporting

29

C

334/28, 18/62, 1

B29C 70/72 (2006.01) B29C 45/14 (2006.01)

Patent

CA 1112407

Abstract of the Disclosure A mold comprising a pair of mold sections which when closed form separate communicating chambers for receiving a component body and a portion of a non-axial lead extending from the component body at an angle to the axis of the body. Molten plastic introduced into the mold encapsulates the capacitor body while the plastic which surrounds the lead portion is readily detached from the lead portion.

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