Mold for encapsulating a component having non-axial leads

Details Mold for encapsulating a component having non-axial leads Mold for encapsulating a component having non-axial leads

B - Operations, Transporting

29

C

334/28, 18/62, 1

B29C 70/72 (2006.01) B29C 45/14 (2006.01)

Patent

CA 1114572

Abstract of the Disclosure A mold comprising a pair of mold sections which when closed form separate communicating chambers for receiving a component body and a portion of a non-axial lead extending from the component body. Molten plastic introduced into the mold encapsulates the capacitor body while the plastic which surrounds the lead portion is readily detached from the lead portion.

317261

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