Moldable elastomeric pressure sensitive adhesives

Details Moldable elastomeric pressure sensitive adhesives Moldable elastomeric pressure sensitive adhesives

C - Chemistry, Metallurgy

09

J

400/4106, 400/53

C09J 183/04 (2006.01) A61L 15/58 (2006.01) A61L 24/04 (2006.01) C08L 83/04 (2006.01)

Patent

CA 1327665

MOLDABLE ELASTOMERIC PRESSURE SENSITIVE ADHESIVES ABSTRACT A composition and method for forming elastomeric pressure sensitive adhesives comprising a mixture of (A) a xylene-soluble resin copolymer of 0.6 to 0.9 triorganosiloxy units per SiO4/2 unit and having less than 0.7 weight percent silicon-bonded hydroxyl units, (B) a polydiorganosiloxane fluid endcapped with silicon-bonded hydroxyl groups and having a viscosity of from about 50 to 300,000 cP. at 25°C., an organosilicon compound containing an average of more than two silicon-bonded alkoxy groups per molecule, and a condensation catalyst. The cured elastomeric pressure sensitive adhesives formed from these compositions are useful as medical adhesives, such as those used for ostomy seals.

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