Molded circuit board

B - Operations – Transporting – 23 – B

Patent

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356/11

B23B 3/10 (2006.01) C04B 35/00 (2006.01) H01K 3/22 (2006.01) H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 1/18 (2006.01) H05K 3/36 (2006.01) H05K 7/10 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1250959

MOLDED CIRCUIT BOARD Abstract of the Disclosure A circuit board is molded of a heat resistant synthetic resin. Component mounting positions are formed at the time of molding, the mounting positions comprising formations, such as recesses or protrusions, on at least one surface. A circuit pattern is formed on at least one surface and the circuit pattern extends to and over a surface of each formation. A circuit board can be planar or non-planar and be of any desired shape, not necessarily rectangular. - i -

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