Molded circuit component unit for connecting lead wires and...

H - Electricity – 01 – R

Patent

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356/133, 356/134

H01R 13/504 (2006.01) H01R 4/02 (2006.01)

Patent

CA 2022526

A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.

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