Molded electromagnetic shielding housings

H - Electricity – 05 – K

Patent

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Details

H05K 9/00 (2006.01) B29C 45/03 (2006.01) B29C 45/14 (2006.01)

Patent

CA 2261875

An apparatus and method for molding electromagnetic shielding housings is disclosed. The molding apparatus includes a core portion having at least one surface, a cavity portion having an injection opening and a positioning member associated with either the core or cavity portions for retaining a conductive flexible metal grid material on the surface of either the core or cavity portions. Upon injection of moldable plastic through the injection opening, the resultant molded shielding housing has the conductive metal grid material molded integrally to the plastic molding.

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