Molded electronic circuit device

Details Molded electronic circuit device Molded electronic circuit device

H - Electricity

05

K

347/9

H05K 5/06 (2006.01)

Patent

CA 1240776

- 7 - Abstract of the Disclosure A molded electronic circuit device has: a printed circuit board having an electronic circuit, the electronic circuit being partially constituted by heat-radiating electronic elements such as a power transistor; a case for holding the printed circuit board; and a molding synthetic resin material filled in the case between the electronic elements so as to radiate heat from the electronic elements, the molding synthetic resin material being obtained such that silicon carbide or a silicon carbide compound is mixed as a major constituent in an epoxy resin and that a metal oxide is added to a resultant mixture.

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