Molded high voltage splice body

H - Electricity – 01 – B

Patent

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Details

26/136, 18/60

H01B 17/42 (2006.01) B29C 70/74 (2006.01) H02G 1/14 (2006.01) H02G 15/103 (2006.01) B29C 45/00 (2006.01)

Patent

CA 1187272

ABSTRACT OF THE DISCLOSURE A method for making a molded high voltage splice body by positioning a conductive elastomeric electrode on a mandrel, positioning an extruded conductive elastomeric sleeve over the elastomeric electrode, sealing the ends of the elastomeric sleeve, placing the mandrel with the electrode and sleeve on it into a mold, injecting a curable insulating compound between the electrode and the sleeve under pressure and curing the insulating compound.

417573

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