H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143, 356/146
H01L 23/28 (2006.01) H01L 23/495 (2006.01) H01L 25/16 (2006.01)
Patent
CA 2039417
The present invention is a molded Hybrid Integrated Circuit package in which a carrier substrate with a various circuit elements including an integrated circuit is supported within a resilient craddle formed by down-set and compliant portions of leads arranged in a quad configuration around the periphery of the carrier substrate, with ends of the down-set portions being secured to pads arranged on the periphery of the carrier substrate. Prior to the assembly with carrier substrate and molding of the resultant subassembly, the leads form a part of a lead frame including elongated bar and dam-bar on each of the quad sides interconnecting end and central portions, respectively, of the leads, and an interconnecting array of connecting links andbridges at the ends of the dam-bars. The lead-frame design, including the down-set and resilient portions of the leads, provides for the stress relief between the carrier substrate and the lead frame, especially during the thermo-bond lead attachment and molding of an encapsulating resin around the carrier substrate and leads subassembly.
Biswas Ranjit
Curtis Hazen III
American Telephone And Telegraph Company
Kirby Eades Gale Baker
LandOfFree
Molded hybrid ic package and lead frame therefore does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molded hybrid ic package and lead frame therefore, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded hybrid ic package and lead frame therefore will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1560552