Molded parts from hot melt adhesives

Details Molded parts from hot melt adhesives Molded parts from hot melt adhesives

C - Chemistry, Metallurgy

09

J

C09J 123/00 (2006.01) C09J 125/06 (2006.01) C09J 133/00 (2006.01) C09J 167/00 (2006.01) C09J 177/06 (2006.01)

Patent

CA 2671011

The invention relates to a molded part for bonding to metal or plastic substrates for use as a fastening element. Said molded part comprises a hot melt adhesive, said hot melt adhesive being based on polyamide, polyolefins, polyesters, polyacrylates or polystyrene. The molded part according to the invention is characterized in that the hot melt adhesive has a softening point between 100° and 250°C, a tensile stress at yield of between 1 and 35 MPa and the molded part consists entirely of the hot melt adhesive. The invention also relates to a method for bonding molded parts from hot melt adhesives to substrates by way of inductive heating.

L'invention concerne un élément moulé destiné à être collé sur des substrats en métal ou plastique en tant que dispositif de fixation, contenant une colle fusible à base de polyamide, de polyoléfines, de polyesters, de polyacrylates ou de polystyrol. L'élément moulé selon l'invention est caractérisé en ce que la colle fusible présente une température de ramollissement comprise entre 100°C et 250°C et une limite d'élasticité comprise entre 1 et 35 MPa, et en ce que l'élément moulé est entièrement constitué de la colle fusible. L'invention concerne également un procédé de collage d'éléments moulés constitués de colles fusibles sur des substrats par chauffage inductif.

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