Molded plastic casing with electromagnetic shielding structure

H - Electricity – 05 – K

Patent

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Details

H05K 9/00 (2006.01) H05K 5/00 (2006.01)

Patent

CA 2050851

Abstract of the Disclosure A molded plastic casing having an electromagnetic shielding structure. A metal film is formed on an inner face of the casing, and a printed circuit board having a metal core embedded therein is accommodated in the inside of the casing in such a manner as to divide the inside of the casing into two chambers. A plurality of plated through-holes are formed in the printed circuit board, and high frequency functioning circuits are mounted on the opposite faces of the printed circuit board. A plurality of metal lands are formed on the opposite faces of a peripheral portion of the printed circuit board and individually connected to the metal core by way of the plated through-holes. A plurality of U-shaped springs each having a plurality of tongues formed integrally thereon are mounted at the peripheral portion of the printed circuit board in individual contact with the metal lands such that the tongues thereof are held in resilient contact with the metal film.

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