Molded printed circuit card frame

H - Electricity – 05 – K

Patent

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356/21

H05K 1/02 (2006.01) H05K 7/14 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1078527

ABSTRACT A printed circuit card frame of a moldable, flowable plastic which plastic is non-hygroscopic, high temperature resistant, non-toxic and non-flammable and which has a flexural strength of about 27,000 lbs./in2, a tensile strength of about 18,000 lbs./in2 and a coef- ficient of linear thermal expansion of about 2.41x10-5 cm/cm/°C. The card frame is molded to include air passages and connector pin holes and reinforced with at least one rib and a plurality of metallic compression inserts.

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