Molded waveguide components

Details Molded waveguide components Molded waveguide components

H - Electricity

01

P

H01P 3/12 (2006.01) H01P 11/00 (2006.01)

Patent

CA 2095648

A microwave assembly having molded thermoplastic components that are first assembled into an enclosure, and then electroless copper plated to provide for RF conductivity. Assemblies are made by bonding bare thermoplastic components, after which the bonded assembly is electroless copper plated. The components are made of an injection molding material, polyetherimide, or a high strength, high temperature thermoplastic. The components are assembled using a one component epoxy adhesive, for example. All components are designed to be self locating to aid in assembly. A bonding fixture is used to apply clamping pressure to the components while the adhe- sive cures. After bonding, the waveguide assembly has its critical flange surfaces finish machined prior to plating.

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