Molding and sealing compound

Details Molding and sealing compound Molding and sealing compound

C - Chemistry, Metallurgy

08

L

C08L 83/00 (2006.01) C08K 3/36 (2006.01) C08K 5/57 (2006.01) C08L 27/06 (2006.01) C08L 101/10 (2006.01) C09K 3/10 (2006.01)

Patent

CA 2044305

- 12 - Abstract A one-component moulding and sealing compound based on prepolymers with terminal silyl groups with at least one hydrolyzable substituent on the Si atom, organo-metallic tin compounds as catalyst and also inorganic fillers contains polyvinyl chloride and fatty acid amide having thixotropic effect to reduce surface tackiness.

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