Molding apparatus and molding process utilizing the same

Details Molding apparatus and molding process utilizing the same Molding apparatus and molding process utilizing the same

B - Operations, Transporting

29

C

B29C 49/28 (2006.01) B29C 49/20 (2006.01) B29C 49/48 (2006.01) B29C 49/64 (2006.01) B29C 49/78 (2006.01) B29C 49/04 (2006.01)

Patent

CA 2173077

A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh °C and a longitudinal elastic modulus of 0.01 to 10 kg/cm2. In the space, a heating fluid for heating the molding surface from the bask side to a temperature higher than or equal to Vicat softening temperate (T) °C of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin - 10) °C are supplied.

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