Molding apparatus with improved ejector pin

Details Molding apparatus with improved ejector pin Molding apparatus with improved ejector pin

B - Operations, Transporting

29

C

18/713

B29C 45/40 (2006.01) B22D 17/22 (2006.01) B29C 33/44 (2006.01)

Patent

CA 1315059

ABSTRACT OF THE DISCLOSURE A molding apparatus comprising a mold piece having therein an aperture and including a surface at least partially defining a mold cavity, the mold piece being made of a first material, an ejector pin slideably housed in the aperture and made of second material substantially softer than the first material, and a mechanism for moving the ejector pin relative to the mold piece so that the ejector pin separates a molded part from the mold piece surface.

607819

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