C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
261/45, 400/5330
C08K 3/00 (2006.01) C04B 24/30 (2006.01) C04B 24/42 (2006.01) C04B 28/02 (2006.01) C08L 61/00 (2006.01)
Patent
CA 1080380
ABSTRACT OF THE DISCLOSURE A molding composition comprises (A) a mixture of (1) a thermosetting resin of at least one of the phenol-formaldehyde condensates, phenol-aminoplast-formaldehyde condensates, amino- plast-formaldehyde condensates, resorcinol-formaldehyde conden- sates, or resorcinol-formaldehyde-urea condensates and (2) cement, wherein the cement is present in an amount within the range of from about 1 to about 20 parts by weight of cement per part by weight of the water content of the thermosetting resin; or (B) a condensate resin formed from cement, formaldehyde, and at least one of phenol, aminoplasts or resorcinol, wherein the weight of the cement is from one to twenty parts by weight of cement per part by weight of the water used to form the resin and three- fifths of the weight of the formaldehyde used to form the resin. Preferably, the amount of cement is from 1 to 9 parts by weight of cement per part by weight of the water, and the weight ratio of thermosetting resin to cement ranges from 1:1 to 1:4. The composition optionally may include an organo-silane or amino- alkylsilane coupling agent and a clay, and also other known fill- ers and mold release agents.
239117
Bell Reuben H.
Cottrell Watter D. (jr.)
Foley Kevin M.
Lawson Ernest E. (jr.)
Mccombs Frank P.
Corporation Owens-Corning Fiberglas
Na
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