Molding compounds

Details Molding compounds Molding compounds

C - Chemistry, Metallurgy

08

L

400/2024, 400/45

C08L 9/00 (2006.01) C08L 25/10 (2006.01) C08L 67/06 (2006.01)

Patent

CA 1074942

ABSTRACT OF THE DISCLOSURE The surface characteristics, including shrink and gloss of molded thermosetting resin compounds, are improved by incorporating into the thermosetting resin a thermoplastic composition produced by the polymerization of a monomer with unsaturated elastomeric polymers.

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