Molding for holding heat sinks in a clamped stack

Details Molding for holding heat sinks in a clamped stack Molding for holding heat sinks in a clamped stack

H - Electricity

01

L

H01L 23/34 (2006.01) H01L 23/473 (2006.01) H01L 25/07 (2006.01)

Patent

CA 2276885

In a semiconductor clamped stack, in particular for high-power converters, a plurality of power semiconductor components are arranged alternately together with water-cooled cooling cans in a stack. A clear arrangement of all the components and supplies is achieved, and defective semiconductor components can be replaced more easily, in that a molding (10) according to the invention is used for holding in each case one heat sink and one power semiconductor component. Rails and latching-in fasteners are provided for guiding and holding the latter.

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