Molding material

Details Molding material Molding material

C - Chemistry, Metallurgy

08

L

C08L 67/02 (2006.01) C08K 5/29 (2006.01) C08K 5/353 (2006.01) C08L 69/00 (2006.01)

Patent

CA 2202573

Disclosed is a molding material comprising: (A) 41-99 wt% of linear thermoplastic polyester, (B) 59-1 wt% of polycarbonate, (C) 0.02-5 wt% of isocyanate and (D) 0.02-5 wt% of bisoxazoline, each based on the total of (A) and (B). The molding material has improved resistance to humidity as compared with when (C) and (D) are not contained.

On divulgue une matière à mouler comprenant : (A) 41-99 % en poids d'un polyester thermoplastique linéaire, (B) 59-1 % en poids de polycarbonate, (C) 0,02-5 % en poids d'isocyanate et (D) 0,02-5 % en poids de bisoxazoline, par rapport au poids total de (A) et (B). La matière à mouler possède une résistance améliorée à l'humidité par rapport à la résistance obtenue en l'absence de (C) et (D).

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