C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/1129, 400/40
C08L 27/06 (2006.01) C08L 71/12 (2006.01)
Patent
CA 1061027
Abstract of the Disclosure The invention relates to thermoplastic molding materials, of high heat distortion point, comprising polyvinyl chloride or copolymers of vinyl chloride with other vinyl compounds, and polyphenylene oxides. The molding materials according to the invention comprises a blend consisting of a) 30 - 90 % by weight of polyvinyl chloride or of co- polymers of vinyl chloride with up to about 30 % by weight based on the weight of the co- polymer of one or more other vinyl compounds which are copolymerizable with vinyl chloride, and b) about 10 - 70 % by weight of a polyphenylene oxide. Particularly preferred molding materials comprise a blend consisting of a) 30 - 70 % by weight of polyvinyl chloride or of its co- polymers with up to about 30 % by weight based on the weight of the copolymer of copolymerizable vinyl compounds, and b) about 70- 30 % by weight of a polyphenylene oxide.
232920
Adelmann Siegfried
Braese Hans-Eberhard
Hardt Dietrich
Margotte Dieter
Vernaleken Hugo
Aktiengesellschaft Bayer
Na
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