C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5803
C08L 77/00 (2006.01) F02F 7/00 (2006.01)
Patent
CA 1288885
Abstract of the Disclosure: A molding polyamide resin composition comprising 100 parts by weight of (A) a poly(m-xylylenesebacamide) resin, and 1 to 20 parts by weight of (B) a crystalline polyamide having a melting point about 20-30°C higher than that of the poly(m-xylylenesebacamide) resin (A).
553083
Kurokawa Masashi
Narita Kenichi
Nomura Isao
Kurokawa Masashi
Mitsubishi Gas Chemical Company Inc.
Narita Kenichi
Nomura Isao
Smart & Biggar
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