Molding process

B - Operations – Transporting – 29 – C

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B29C 39/10 (2006.01) B29C 37/00 (2006.01) B29C 70/78 (2006.01) B29D 17/00 (2006.01) G11B 7/26 (2006.01) B29C 35/08 (2006.01) B29C 45/00 (2006.01) B29C 67/24 (2006.01)

Patent

CA 1235271

- 1 - Patent Application of Nicholas A. Rounds Docket No. 83-35 MOLDING PROCESS ABSTRACT Process for forming a polymeric layer on a substrate comprises placing a substrate to be coated in a mold having a removable lid, injecting a liquid monomer into the mold and into contact with the surface of the substrate to be coated, holding the substrate in place in said mold prior to curing said monomer, radiation curing the liquid monomer, releasing the hold on said substrate prior to significant shrinkage of the curing liquid monomer, and venting said mold to atmospheric pressure at the portion of the mold remote from the surface of the substrate being coated and prior to significant shrinkage of said liquid monomer whereby the substrate moves toward the removable lid. Thereafter, the substrate, which now has a polymeric layer affixed thereto, is removed from the mold.

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