Monitoring electroless plating baths

Details Monitoring electroless plating baths Monitoring electroless plating baths

C - Chemistry, Metallurgy

23

C

C23C 18/31 (2006.01) C23C 18/16 (2006.01) H05K 3/18 (2006.01)

Patent

CA 2110354

- 9 - Disclosed is a method of monitoring electroless plating solutions. The solutions are used to plate a light-transmitting medium. Measurements are made to determine the time it takes for light transmission through the medium to be reduced to a certain level. This measurement can be used to determine whether articles will be sufficiently plated by the solutions.

- 9 - La présente invention se rapporte à une méthode pour contrôler le rendement de solutions autocatalytiques utilisées pour la métallisation d'objets transmettant la lumière. Des mesures sont effectuées afin de déterminer le temps nécessaire pour réduire à un niveau prédéterminé la transmission de la lumière à travers l'objet. Ces mesures permettent de déterminer si les objets traités ont reçu un placage suffisant.

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