Monolithic multilayer ultra thin chip inductors and method...

H - Electricity – 01 – F

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H01F 41/04 (2006.01) H01F 17/00 (2006.01)

Patent

CA 2186055

A monolithic multilayer ultra thin chip inductor (10) is manufactured with two terminals (12) and (14) on the same end of the component (10) to reduce the mechanical stresses caused by a coefficient of expansion mismatch. A third no-connect terminal (16) located on the opposite end may be used to mount the component (10) when a more rigid connection is required. The inductor is constructed using a bottom and top coil layer (18) and (40), each having a coil and forming a termination point corresponding to the inductor terminals. The opposite ends of the coils form connection ends (24) and (68) and are electrically connected to form a continuous coil from one terminal (12) to the other (14). Optionally, a number of intermediate coil layers (28) can be included between the bottom and top coil layers (18) and (40). The coil layers are selected from a set of coil layers. As a result, the total number of coil turns can be obtained by selecting the appropriate coil layers.

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