C - Chemistry – Metallurgy – 07 – H
Patent
C - Chemistry, Metallurgy
07
H
C07H 21/00 (2006.01) C07B 61/00 (2006.01) C07F 9/143 (2006.01) C07F 9/24 (2006.01) C07F 9/547 (2006.01) C07F 9/572 (2006.01) C07F 9/59 (2006.01) C07F 9/6503 (2006.01) C07F 9/6506 (2006.01) C07F 9/6512 (2006.01) C07F 9/6521 (2006.01) C07F 9/6533 (2006.01) C07F 9/6547 (2006.01) C07F 9/6561 (2006.01) C12Q 1/68 (2006.01)
Patent
CA 2180867
Novel ethylene glycol compounds bearing various functional groups are used to prepare oligomeric structures. The ethylene glycol monomers can be joined via standard phosphate linkages including phosphorothioate, phosphodiester, and phosphoramidate linkages. Usseful functional groups include nucleobases as well as polar groups, hydrophobic groups, ionic groups, aromatic groups and/or groups that participate in hydrogen-bonding.
On utilise de nouveaux composés d'éthylène glycol portant plusieurs groupes fonctionnels pour préparer des structures oligomères. Les monomères d'éthylène glycol peuvent être liés à l'aide de liaisons phosphate classiques telles que les liaisons phosphorothioate, phosphodiester et phosphoramidate. Les groupes fonctionnels utiles comprennent des nucléobases ainsi que des groupes polaires, des groupes hydrophobes, des groupes ioniques, des groupes aromatiques et/ou des groupes participant à la liaison hydrogène.
Acevedo Oscar L.
Cook Phillip Dan
Davis Peter W.
Ecker David J.
Hebert Normand
Isis Pharmaceuticals Inc.
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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