Morphing fillers and thermal interface materials

Details Morphing fillers and thermal interface materials Morphing fillers and thermal interface materials

H - Electricity

01

L

H01L 23/373 (2006.01) C09K 5/00 (2006.01) F28F 21/00 (2006.01)

Patent

CA 2401299

A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120°C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.

Affiliated with

Also associated with

Rating

Morphing fillers and thermal interface materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Morphing fillers and thermal interface materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Morphing fillers and thermal interface materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1608069