H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1, 402/243
H05K 1/03 (2006.01) H05K 1/00 (2006.01)
Patent
CA 1300306
AE 5875 A B S T R A C T Moulded printed circuit board. The invention relates to a thermoplastic moulded printed circuit board consisting substantially of polyamide 4.6. Preferably use is made of a multilayer structure, of which at least one layer contains reinforcing filler material.
587192
Fetherstonhaugh & Co.
Peerlkamp Erik R.
Stamicarbon B.v.
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